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Hochfrequenztechnik-PhotonikECOC_Tekin_2

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Veröffentlichungen - Publications

T. Tekin, H. Schroder, L. Zimmermann, P. Dumon, W. Bogaerts
Fibre-array optical interconnection for silicon photonics
Proc. ECOC 2008, Brüssel, Belgien, Sept. 2008.


Abstract
Commercial multi-fibre array coupled to vertical grating coupler on a SOI (Silicon on insulator) chip, which is suitable for cost effective, compact interconnect for smart photonics packaging (ePIXpack).


This paper was published in Proc. ECOC 2008, IEEE and is made available as an electronic reprint with the permission of IEEE. The paper can be found at the following URL on the IEEE website. Systematic or multiple reproduction or distribution to multiple locations via electronic or other means is prohibited and is subject to penalties under law.

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