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Veröffentlichungen - Publications

G. Unterbörsch, M. Kroh, J. Honecker, A. G. Steffan, G. Tsianos, H.-G. Bach, J. Kreissl, R. Kunkel, G. G. Mekonnen, W. Rehbein, D. Schmidt, J. Bruns, T. Mitze, K. Voigt, L. Zimmermann
Hybrid Flip-Chip Integration of a 40 Gb/s DPSK Receiver Comprising a Balanced Photodetector on a DLI-SOI Board
Proc. ECOC 2008, P.2.04, Brüssel, Belgien, Sept. 2008.


Abstract
A DPSK receiver concept using flipchip hybrid integration of InP photodetectors on SOI boards with optical decoder is presented. Horizontal waveguiding enables low-cost production for high data rates.



This paper was published in Proc. ECOC 2008, P.2.04, IEEE and is made available as an electronic reprint with the permission of IEEE. The paper can be found at the following URL on the IEEE website. Systematic or multiple reproduction or distribution to multiple locations via electronic or other means is prohibited and is subject to penalties under law.

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